ELECTRICALLY CONDUCTIVE SELANT
CHO-BOND 1075 is a silver-plated, aluminium-filled, conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
| Category | Conductive Adhesives | Brand | Parker Hannifin |
| Part No. | CHO-BOND 1075/1086 | OEM Part No. | Not Avaliable |
| Alt Part No. | Not Avaliable | Country of Origin | Not Available |
| Pro Category | Not Available | Is Return | Yes |
The minimum recommended bond line for CHO-BOND 1075 is 0.010 inches (0.25mm). In addition, CHO-BOND 1075 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (100 psi) is required. The silver aluminium filler of CHO-BOND 1075 provides excellent galvanic corrosion resistance when applied to aluminium substrates.
No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1075 a good choice for a variety of commercial and military applications. CHO-BOND 1075's moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures.
CHO-BOND 1075 should be used in conjunction with CHOSHIELD 1086 primer (supplied in this kit) for best adhesion results. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.
CHO-BOND 1075/1086